TiO2 thin-film dielectric properties are impacted by annealing
Abstract
Purpose: This study investigates the structural, morphological, and dielectric properties of TiO₂ thin films deposited using the Spray Pyrolysis Deposition (SPD) process and annealed at various temperatures.
Experimental: X-ray diffraction (XRD) analysis confirms the absence of an amorphous phase at 300 °C, while the anatase and rutile phases emerge at 400 °C, 500 °C, and 600 °C, with crystallite sizes increasing from 10.62 to 17.35 nm. Scanning electron microscopy (SEM) reveals a consistent grain growth trend, with grain sizes exceeding XRD estimates. Energydispersive X-ray (EDAX) spectroscopy confirms a stoichiometric Ti:O ratio and uniform nanoparticle distribution. The dielectric properties of Pt/TiO₂/Si MOS capacitors were analyzed, demonstrating improved electrical stability with annealing. Conductance studies indicate a reduction in defect states, enhanced crystallinity, and stable dielectric behavior at higher frequencies. The hysteresis loop analysis reveals decreased losses at 600 °C due to minimized trapped charges and broken bonds. Impedance spectroscopy highlights capacitive behavior, with relaxation peaks at 400 °C, 500 °C, and 600°C, while conductance measurements indicate thermal activation of charge carriers.
Conclusions: These findings suggest that TiO₂ thin films exhibit promising dielectric properties for potential applications in Si-based MOS capacitors and VLSI technology
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References
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