Electrocrystallisation of Cu-Sn-TiO2 composite coatings in sulphuric acid electrolytes

Aliaksandr A. Kasach; Dzmitry S. Kharytonau; Ivan M. Zharskii; Irina I. Kurilo

doi:10.17308/kcmf.2022.24/9262

Aliaksandr A. Kasach Belarusian State Technological University 13a Sverdlova st., Minsk 220006, Belarus https://orcid.org/0000-0001-5522-2928
Dzmitry S. Kharytonau Jerzy Haber Institute of Catalysis and Surface Chemistry, Polish Academy of Sciences, 8 Niezapominajek , Krakow 30-239, Poland https://orcid.org/0000-0003-2071-3975
Ivan M. Zharskii Belarusian State Technological University 13a Sverdlova st., Minsk 220006, Belarus https://orcid.org/0000-0002-3942-5175
Irina I. Kurilo Belarusian State Technological University 13a Sverdlova st., Minsk 220006, Belarus https://orcid.org/0000-0002-0016-6719

DOI: https://doi.org/10.17308/kcmf.2022.24/9262

Keywords: Electrocrystallisation, Formation of alloys, Composite coating, Pulsed electrolysis, Structure

Abstract

The aim of the article is to determine the peculiarities of electrochemical production of Cu–Sn–TiO₂ composite coatings in sulphuric acid electrolytes with intermittent agitation under stationary and pulsed modes of electrolysis.

Linear voltammetry and static and pulsed chronopotentiometry were used to study the kinetic features of electrocrystallisation of Cu-Sn-TiO₂ composite coatings in a sulphuric acid electrolyte with intermittent agitation. When the electrolyte was stirred, the cathodic potential shifted towards electropositive values. It was shown that after switching the agitation off, the value of the cathodic potential at which the copper-tin alloy forms at a cathodic current density of –0.013 A/cm² was reached within 70 s and when using pulsed electrolysis, it was reached within 80 s. Scanning electron microscopy established that the most homogeneous and uniform Cu-Sn-TiO₂ coatings were formed when pulsed electrolysis was used.

Intermittent agitation of the sulphuric acid electrolytes led to the formation of ordered multilayer structures consisting of microlayers of the Cu-Sn alloy and copper due to the intermittent elimination of diffusion limitations for the discharge of copper(II) ions when agitation was switched on, which resulted in suppression of the process of the underpotential deposition of tin.

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Author Biographies

Aliaksandr A. Kasach, Belarusian State Technological University 13a Sverdlova st., Minsk 220006, Belarus

Assistant at the Department
of Chemistry, Technology of Electrochemical
Production and Electronic Engineering Materials

Dzmitry S. Kharytonau, Jerzy Haber Institute of Catalysis and Surface Chemistry, Polish Academy of Sciences, 8 Niezapominajek , Krakow 30-239, Poland

PhD in Chemistry,
postdoctoral fellow at

Ivan M. Zharskii, Belarusian State Technological University 13a Sverdlova st., Minsk 220006, Belarus

Cand. Sci. (Chem.), Associate
Professor at the Department of Chemistry

Irina I. Kurilo, Belarusian State Technological University 13a Sverdlova st., Minsk 220006, Belarus

Cand. Sci. (Chem.), Associate
Professor at the Department of Physical, Colloid, and
Analytical Chemistry

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