Electronic structure and spatial architecture of chemically deposited high-phosphorus nickel coatings for application in advanced microelectronics technologies

Authors

  • Vitaly V. Pobedinsky Voronezh State University, 1, Universitetskaya pl., Voronezh 394018, Russian Federation , Research Institute of Electronic Technology, 5, Staryh Bolshevikov st., Voronezh 394033, Russian Federation
  • Nikita S. Buylov Voronezh State University, 1, Universitetskaya pl., Voronezh 394018, Russian Federation , Research Institute of Electronic Technology, 5, Staryh Bolshevikov st., Voronezh 394033, Russian Federation
  • Evgenia A. Ilina Voronezh State University, 1, Universitetskaya pl., Voronezh 394018, Russian Federation
  • Dmitry L. Goloshchapov Voronezh State University, 1, Universitetskaya pl., Voronezh 394018, Russian Federation
  • Eugeny S. Kersnovsky Voronezh State University, 1, Universitetskaya pl., Voronezh 394018, Russian Federation
  • Ivan V. Polshin Voronezh State University, 1, Universitetskaya pl., Voronezh 394018, Russian Federation
  • Andrey I. Chukavin Udmurt Federal Research Center Ural Branch of the Russian Academy of Sciences, 34, T. Baramzina st., Izhevsk 426067, Russian Federation
  • Konstantin V. Zolnikov Voronezh State University of Forestry and Technologies named after G. F. Morozov, 8, Timiryazeva st., Voronezh 394087, Russian Federation
  • Pavel P. Kutsko Research Institute of Electronic Technology, 5, Staryh Bolshevikov st., Voronezh 394033, Russian Federation
  • Pavel L. Parmon Research Institute of Electronic Technology, 5, Staryh Bolshevikov st., Voronezh 394033, Russian Federation
  • Igor V. Semeykin Research Institute of Electronic Technology, 5, Staryh Bolshevikov st., Voronezh 394033, Russian Federation
  • Ivan V. Koniaev Research Institute of Electronic Technology, 5, Staryh Bolshevikov st., Voronezh 394033, Russian Federation
  • Pavel V. Seredin Voronezh State University, 1, Universitetskaya pl., Voronezh 394018, Russian Federation

DOI:

https://doi.org/10.17308/kcmf.2026.28/13566

Keywords:

Electroless nickel plating, High-phosphorus nickel coatings, Barrier layer, TSV technology, Heterogeneous 3D integration

Abstract

Objectives: This article examines the suitability of chemically deposited high-phosphorus nickel-phosphorus coatings as barrier layers for Through-Silicon Via (TSV) technology. Energy-dispersive X-ray microanalysis revealed that the phosphorus content in the coating is 10.2 wt. % (17.8 at. %). This high phosphorus concentration ensures the coating remains in an amorphous state, which is a critical prerequisite for effective barrier performance.

Experimental: Using X-ray photoelectron spectroscopy and soft X-ray spectroscopy, it was determined that the spherical globular formations comprising the coating have a core–shell structure. It was also demonstrated that the phosphorus concentration in the shell is higher than in the core.

Conclusions: The results obtained are of significant interest for advancing modern semiconductor manufacturing technologies, particularly in the area of heterogeneous 3D integration

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Author Biographies

  • Vitaly V. Pobedinsky, Voronezh State University, 1, Universitetskaya pl., Voronezh 394018, Russian Federation, Research Institute of Electronic Technology, 5, Staryh Bolshevikov st., Voronezh 394033, Russian Federation

    Cand. Sci. (Eng.), Advisor to the General Director, Research Institute of Electronic Technology (Voronezh, Russian Federation)

  • Nikita S. Buylov, Voronezh State University, 1, Universitetskaya pl., Voronezh 394018, Russian Federation, Research Institute of Electronic Technology, 5, Staryh Bolshevikov st., Voronezh 394033, Russian Federation

    Cand. Sci. (Phys.–Math.), Educator, Department of Solid State Physics and Nanostructures, Voronezh State University (Voronezh, Russian Federation)

  • Evgenia A. Ilina, Voronezh State University, 1, Universitetskaya pl., Voronezh 394018, Russian Federation

    Junior Researcher, Laboratory of organic additives for the processes of chemical and electrochemical deposition of metals and alloys used in the electronics industry, Voronezh State University (Voronezh, Russian Federation)

  • Dmitry L. Goloshchapov, Voronezh State University, 1, Universitetskaya pl., Voronezh 394018, Russian Federation

    Cand. Sci. (Phys.–Math.), Assistant Professor, Department of Solid State Physics and Nanostructures, Voronezh State University (Voronezh, Russian Federation)

  • Eugeny S. Kersnovsky, Voronezh State University, 1, Universitetskaya pl., Voronezh 394018, Russian Federation

    graduate student, Technician, Department of Solid State Physics and Nanostructures, Voronezh State University, (Voronezh, Russian Federation)

  • Ivan V. Polshin, Voronezh State University, 1, Universitetskaya pl., Voronezh 394018, Russian Federation

    magistrate, Laboratory Assistant, Department of Solid State Physics and Nanostructures, Voronezh State University, (Voronezh, Russian Federation)

  • Andrey I. Chukavin, Udmurt Federal Research Center Ural Branch of the Russian Academy of Sciences, 34, T. Baramzina st., Izhevsk 426067, Russian Federation

    Cand. Sci. (Phys.–Math.), Senior Researcher, Udmurt Federal Research Center of the Ural Branch of the Russian Academy of Sciences (Izhevsk, Russian Federation)

  • Konstantin V. Zolnikov, Voronezh State University of Forestry and Technologies named after G. F. Morozov, 8, Timiryazeva st., Voronezh 394087, Russian Federation

    Cand. Sci. (Eng.), Associate Professor, Head of the Department, Basic Department of Technical and Software Support for Computing and Information Systems, Voronezh State Forestry Engineering University named after G. F. Morozov (Voronezh, Russian Federation)

  • Pavel P. Kutsko, Research Institute of Electronic Technology, 5, Staryh Bolshevikov st., Voronezh 394033, Russian Federation

    Cand. Sci. (Eng.), General Director, Research Institute of Electronic Technology (Voronezh, Russian Federation)

  • Pavel L. Parmon, Research Institute of Electronic Technology, 5, Staryh Bolshevikov st., Voronezh 394033, Russian Federation

    Director of Quality, Research Institute of Electronic Technology (Voronezh, Russian Federation

  • Igor V. Semeykin, Research Institute of Electronic Technology, 5, Staryh Bolshevikov st., Voronezh 394033, Russian Federation

    Cand. Sci. (Eng.), Technical Director, Research Institute of Electronic Technology (Voronezh, Russian Federation)

  • Ivan V. Koniaev, Research Institute of Electronic Technology, 5, Staryh Bolshevikov st., Voronezh 394033, Russian Federation

    Cand. Sci. (Eng.), Lead Engineer, Research Institute of Electronic Technology (Voronezh, Russian Federation)

  • Pavel V. Seredin, Voronezh State University, 1, Universitetskaya pl., Voronezh 394018, Russian Federation

    Dr. Sci. (Phys.–Math.), Full Professor, Chair of department, Department of Solid State Physics and Nanostructures, Voronezh State University (Voronezh, Russian Federation)

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Published

2026-04-01

Issue

Section

Short communication

How to Cite

Electronic structure and spatial architecture of chemically deposited high-phosphorus nickel coatings for application in advanced microelectronics technologies. (2026). Kondensirovannye Sredy I Mezhfaznye Granitsy = Condensed Matter and Interphases, 28(1), 143-147. https://doi.org/10.17308/kcmf.2026.28/13566

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