Electronic structure and spatial architecture of chemically deposited high-phosphorus nickel coatings for application in advanced microelectronics technologies
DOI:
https://doi.org/10.17308/kcmf.2026.28/13566Keywords:
Electroless nickel plating, High-phosphorus nickel coatings, Barrier layer, TSV technology, Heterogeneous 3D integrationAbstract
Objectives: This article examines the suitability of chemically deposited high-phosphorus nickel-phosphorus coatings as barrier layers for Through-Silicon Via (TSV) technology. Energy-dispersive X-ray microanalysis revealed that the phosphorus content in the coating is 10.2 wt. % (17.8 at. %). This high phosphorus concentration ensures the coating remains in an amorphous state, which is a critical prerequisite for effective barrier performance.
Experimental: Using X-ray photoelectron spectroscopy and soft X-ray spectroscopy, it was determined that the spherical globular formations comprising the coating have a core–shell structure. It was also demonstrated that the phosphorus concentration in the shell is higher than in the core.
Conclusions: The results obtained are of significant interest for advancing modern semiconductor manufacturing technologies, particularly in the area of heterogeneous 3D integration
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